The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs…

• •FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
• •HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high- density racks.