The Vertiv™ CoolChip Fluid Network is a purpose-built fluid distribution system supporting the growing thermal management demands of high-density compute environments. It includes in-rack and in-row manifold configurations, enabling flexible deployment across hyperscale, colocation, and enterprise data centers. It is the final link in Vertiv's thermal chain from the coolant distribution unit to the chip, providing consistent performance and modular scalability for advanced AI cooling needs.

• •RELIEABLY TESTED FOR QUALITY:  Each row manifold assembly is flushed, passivated, pressure-tested, and sealed to provide superior cleanliness, corrosion resistance, and leak-free performance.​
• •ACCELERATED DEPLOYMENT:  It simplifies processes through pre-configured, in-stock options and optimized designs that reduce complexity across planning, procurement, and installation stages.​